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Micro-CT in Electronics 1 Micro-CT in Electronics 2

Previously, deformations in electronic components and assemblies have been measured using optical methods which require the cross-sectioning of the solder joint. Micro-CT does not require cross-sectioning of the part for the purpose of deformation and strain measurement. Micro-CT is capable of providing high resolution imaging of the common defect types and failure modes in electronic assemblies. Micro-CT is used in electronics for example in:

  • Measurement of displacements in solder joints
  • Advanced electronics packaging
  • Interconnections
  • Outside connections
  • Crack and defect detection in SAC solder interconnects

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